Process Simulation Example Using Si (100) Wafers
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- Time of issue:2022-07-03
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Process Simulation Example Using Si (100) Wafers
(Summary description)
- Categories:Software case
- Author:
- Origin:
- Time of issue:2022-07-03
- Views:967
Fabrication of Octagonal Structures Using Si (100) Wafers
Etch rate distribution of Si(100) wafers in KOH solution:
Etching from the (100) direction results in a structure with four stable planes (see red circles), resulting in a quadrilateral cross-section according to the rate distribution in the figure below. In order to construct an octagon, we need to find four sublevels of stable planes (see blue circle).
Layout design:
Guided by this idea, we designed a cross-shaped layout structure. By appropriately controlling the etching time, the four secondary stable surfaces and the four main stable surfaces appear simultaneously, thereby forming an octagonal cross-section (bottom hole).
Corrosion result:
The images below show the etched structure of the Si(100) wafer from the front and back, respectively.
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