TEM thermal-electric-mechanical coupling analysis module

To carry out thermal, electrostatic, mechanical, thermal-mechanical-electric coupling and fluid-solid coupling analysis in static, dynamic, transient and frequency domain and other types.

◆ Define stress gradient, and add coriolis force in a convolute means;

◆ Changing FEA issues and unique EFM functions;

◆ Finite element and boundary element solvers;

◆ Precision electrostatic driving device model;

◆ Compatible with ANSYS, PATRAN and IDEAS;

◆ Use IntelliFab module to generate a finite element model or use a 3DBuilder to generate a 3D model of element;

◆ Include the relationship among thermal conductivity, electrical resistivity, thermal expansion coefficient, density and temperature;

◆ Contact analysis, piezoelectric, piezoresistive and packaging analysis;

◆ Precision electromechanical coupling dynamic analysis, to achieve dynamic electromechanical coupling simulation based on the true 3D device structure;

◆ Extended piezoelectric analysis function, to include charge density outside the voltage load, and can be used to study the open-circuit performances of piezoelectric structure; FBAR/SAW/BAW designers are able to quickly calculate the serial and parallel resonance through the module, and then calculate the coupling factor;

◆ The piezoelectric transient and dynamic simulations include transient voltage difference input, transient charge density input and the impact of Squeeze Film;

◆ Eigen frequency analysis in a specified mode;

◆ A complete finite element model can conclude a simplified model with an order reduction method, and the model can be used for system-level analysis. The order reduction method is based on Arnoldi order reduction method, Lagrangian mechanics and mode superposition;

◆ Macro model feature extraction, automatic generation of system model of N degrees of freedom, complete recording of nonlinear dynamic behaviors including harmonic and sub-harmonic response;

◆ Create a rigid model for electronics or a high-order model involving second-order effects (parasitic effects, nonlinear deformation, temperature effect and packaging effect) for the design of the compensation-type electrical elements;

◆ Provide 32-bit and 64-bit solvers, support SMP multi-core parallel computing;

◆ Computing of static force of Seebeck effect of thermal-electromotive force;

◆ Analysis and computing of static force, magnetostrictive effect, frequency and dynamic force